service__Technical services The company has an advanced eight-inch wafer-level packaging production line, process capability, equipped with EVG Double-sided alignment photolithography, Sputter, SUSS bonder, EVG high force bonder, thinning equipment, wafer sawing, laser leak detection, and the reliability tester ,and so on.

The company has an advanced eight-inch wafer level packaging production  line, covering cap processing, wafer bonding packaging, grinding,
marking, and so on, .Equipped with EVG Double-sided alignment photolithography, Sputter, SUSS bonder, EVG high force bonder, thinning equipment, wafer sawing, laser leak detection, and the reliability tester, and so on.